View BD9031FV-C_8687077.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

this product is a monolithic silicon integrated circuit this product is not designed to be radiation resistant. 1/ 23 tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 14 ? 001 isolated power supply ic for automotive 1 channel step- up switching regulator controller bd 9031fv-c general description the BD9031FV-C is a 1 ch annel isolated and step- up switching regulator (controller). BD9031FV-C features a wide range of integrated safety functions, e.g. input undervoltage protection, output overvoltage protection, output undervoltage protection, overcurrent protection and thermal shutdown. features ? maximum supply voltage 35v ? accurate reference voltage 1.5% ? adjustable frequency: 2 0k hz to 600k hz ? integrated en functionality ? current mode control ? input undervoltage protection (uvlo) ? overheating protection (tsd) ? output overvoltage protection (ovp) ? output undervoltage protection (uvp) ? overcurrent protection (ocp) ? ssop-b16 package application ? automotive isolated power supplies key specification ? operating supply voltage range: 4.5v to 30v ? switching frequency: 20khz to 600khz ? pch fet on resistance: 6 (typ.) ? nch fet on resistance: 0.84 (typ.) ? standby current: 0 a (t yp.) ? operating temperature range: - 40 c to +125c packages w (typ.) x d (typ.) x h (max.) ssop-b16 5.00mm x 6.40mm x 1.35mm typical application circuits ss op -b16 vreg en bg tsd osc vref protect logic tsd uvlo pwm comp slope drv set reset sw logic err amp vcc oc pgnd fb ss comp ovp enable gnd clamp vreg ocp ocp ovp osc rt out sd dc/dc output shutdown uvp uvp vref figure 1. block diagram and typical application circuit datashee t downloaded from: http:///
2/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 pin configuration figure 2. pin configuration pin description pin no. pin name function 1 n.c. no t connected 2 n.c. no t connected 3 out gate driver output pin 4 vreg regulator output for fet driver pin 5 sd transistor driver pin for shutdown 6 fb error amplifier inverted input pin 7 comp error amplifier output pin 8 gnd ground pin 9 vcc power supply pin 10 en en functionality pin 11 n.c. not connected 12 rt frequency setting pin 13 ss soft start setting pin 14 oc overcurrent detection pin 15 n.c. not connected 16 pgnd power ground pin 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 n.c.n.c. out vreg sd fb comp gnd pgndn.c. oc ss rt n.c. en vcc (top view) downloaded from: http:///
3/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 block diagram vreg en bg tsd osc vref protect logic tsd uvlo pwm comp slope drv set reset sw logic err amp vcc oc pgnd fb ss comp ovp enable gnd clamp vreg ocp ocp ovp osc rt out sd shutdown uvp uvp vref figure 3. block diagram downloaded from: http:///
4/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 explanation of block operations ? vref 3.0v regulator block for internal supply. ? vreg voltage supply block for dc/dc driver. ? tsd thermal protection block that turns off the ic if the internal tempe rature reaches 175c (typ.). ? uvlo undervoltage-lockout block. ? ovp overvoltage protection block that turns off the ic if fb exceeds 0.9 2v (typ.) . if the protection function is activated, the output is turned off and the soft start p in and comp pin voltages are discharged for a fixed period dependent on the oscillation frequ ency. ? uvp undervoltage protection block that turns off the ic if fb drops below 0.6 0v (typ.). if the protection function is activated, the output is turned off and the soft start pin and comp pin voltages are discharged for a fixed period dependent on the oscillation frequ ency. ? error amplifier (err) block that compares the output feedback voltage to the referen ce voltage and outputs the difference to the comp pin, which voltage is used to determine the switching duty cycle. ? oscillator (osc) block that generat es the oscillation frequency. ? slope block that generat es a triangle wave from the clock generated in the oscillator bloc k and sends it to the pwm comparator. ? pwm block that compares the output comp pin voltage of the error amplifie r with the triangle wave of the slope and determines the switching duty. the switching duty is limited by th e internally set maximum duty ratio and cannot become 100%. ? drv dc/dc driver block with the pwm signal as input and that drives the o utput mos. ? soft start block that limits the current at time of startup and gradually in creases the output voltage thereby preventing an overshoot of the output voltage and inrush current. ? oc p overcurrent protection block . the overcurrent protection level is determined by the value of the r esistor placed in between theoc pin and gnd. overcurrent is detected when the oc pin volt age exceeds 0.2v (typ.). the overcurrent detection function is performed every switching pulse cycle . wh en overcurrent is detected 256 times consecutively, the overcurrent protection is activated and the ic is shut down. thus, even if the oc pin reaches or exceeds the overcurrent detection level caused by a dc voltage, the overcurrent protection is not activated since it is only a one time detection. if the protection function is activated the output is turned and the soft start pin and comp pin are discharged for a fixed period depending on the oscillator frequency. ? sd transistor driver block for turning off the ic when a protection functio n is activated (nch open drain). downloaded from: http:///
5/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol rating unit voltage vcc -0.3 to 35* 1 v vreg voltage vreg 7 v en voltage ven vcc v oc voltage voc v reg v sd voltage vsd vcc v power dissipation pd 870* 2 mw operating temperature range top -40 to +1 25 c storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c *1 pd should not be exceeded. *2 7.0mw/ c reduction when ta 25 c if mounted on a glass epoxy board of 70mm70mm1.6mm operating conditions ( ta =-40c to +125c) parameter symbol rating unit min. typ. max. voltage vcc 4.5 14 30 v oscillation frequency fosc 20 600 khz downloaded from: http:///
6/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified: 4.5 vcc 30v , - 40 c t op 125c , current flowing from the ic is defined +) parameter symb ol ratings unit conditions min. typ. max. output block output voltage h1 vouth1 4.5 5.0 5.5 v 5 vcc 30v iout=0a(open) output voltage h2 vouth2 4.0 4.5 - v vcc 4.5v iout=0a(open) output voltage l voutl 0 - 0.3 v iout=0a(open) mos on resistor (source) ron_source 3 6 12 ? isource=10ma mos on resistor (sink) ron_sink 0.46 0.84 1.80 ? isink=-10ma oscillator block oscillation frequency fsw 360 400 440 khz rt=7 2k soft start block output range vssout 1.8 2.2 2.6 v startup charge current istr 7.5 10.0 12.5 a ss=0v shut-off discharge current istp -8.0 -3.0 -0.6 ma error a mp . block threshold voltage veth 0.788 0.800 0.812 v fb=comp input bias current iib -1 - 1 a fb=1.0v output sink current icompsink - 150 - 75 - 20 a fb=1.0v comp=0.8v output source current icompsource 20 75 150 a fb=0.6v comp=0.8v en block threshold voltage ven 1.00 2.15 2.70 v input bias current ien 8 16 32 a en=3v uvlo block uvlo operating voltage vuvlo 3.3 3.6 3.9 v vreg sweep down hysteresis voltage vulohys 200 400 600 mv vreg sweep up overvoltage protection block overvoltage detection threshold vovth 0.90 0.92 0.94 v fb open detection block undervoltage detection threshold vopth 0.57 0.60 0.63 v overcurrent protection block overcurrent detection thresho ld vocth 0.16 0.20 0.24 v hibernation period adjustment block max on duty donmax 77 87 97 % transistor driver block for shutdown pin voltage (normal operation) vsdl 0 - 0.8 v normal ly l isdsink=-1ma leakage current isdleak - - 10 a vsd=30v entire chip average current consumption icc - 3 6 ma switching off this product is not designed to be radiation resistant. downloaded from: http:///
7/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 characteristics data (reference data) 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 supply voltage:vcc[v] standby current:ist[ua] 0 1 2 3 4 5 6 0 5 10 15 20 25 30 supply voltage:vcc[v] circuit current:icc[ma] 1 figure 4. average current consumption figure 5. standby current figure 6. error amp threshold voltage vs. temperature characteristics figure 7. oscillation frequency vs. temperature characteristics 0.780 0.785 0.790 0.795 0.800 0.805 0.810 0.815 0.820 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] amp threshold voltage:veth[v]] 360 370 380 390 400 410 420 430 440 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] osilating frequency:fsw[khz] 125 25 - 40 125 25 - 40 downloaded from: http:///
8/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 figure 8. uvlo operating/return voltage vs. temperature characteristics figure 9. soft start startup charge vs. temperature characteristics figure 10 . overcurrent threshold voltage vs. temperature characteristics figure 11 . fb pin overvoltage/undervoltage threshold voltage vs. temperature characteristics 5 6 7 8 9 10 11 12 13 14 15 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] ss charge current:iss[a] 0.16 0.17 0.18 0.19 0.20 0.21 0.22 0.23 0.24 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] oc threshold voltage:vocth[v] ] 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] uvlo threshold voltage:vuvlo[v]] recover voltage detect voltage 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] fb over/low sense voltage:[v] overvoltage threshold undervoltage threshold downloaded from: http:///
9/ 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 figure 12 . en threshold voltage vs. temperature characteristics figure 13 . fb pin input bias current vs. temperature characteristics figure 14 . on duty characteristics figure 15 . max. on duty vs. temperature characteristics 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] en threshold voltage:ven[v] 0.0 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] fb input current:iib[a] 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 comp voltage:vcomp[v] on duty:duty[%] 70 75 80 85 90 95 100 -40 -20 0 20 40 60 80 100 120 ambient temperature:ta[ ] max on duty:donmax[%] ] downloaded from: http:///
10 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 timing cha rt detection time the ic will be shut down if the time resulting from the following equation is exceeded. after ocp detection, t1 = 1/f 256clk (s) time needed for the oc pin output pulse to synchronize with the sw itching frequency and for the ocp block to perform 256 consecutive detections. after ovp or uvp detection: t2 = 1/f 4clk (s) release time the output is turned off and the soft start and comp voltages are discharged during the time resulting from the following equation. ovp or uvp or ocp, t3 = 1/f 1024clk (s) f: oscillator frequency (khz) ocp 0.92v uvlo vcc vreg fb oc sd tsd on tsd off uvlo t3 out ss uvlo ocp ovp tsd t1 t3 t2 0.80v 0.60v uvp t3 t2 0.80v 0.2v figure 16. timing chart downloaded from: http:///
11 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 overvoltage protection (ovp) timing chart this chart shows the overvoltage detection start time after startup. this start time can be calculated as follows: t4=2.2v (typ.) c ss /10a (typ.) (s) 2.2v (typ.):soft start output range c ss : ss pin external capacitor 10a (typ.): soft start charge current th e over-voltage is detected after the soft start voltage reaches 2 .2v (typ.). undervoltage protection (uvp) timing chart this chart shows the undervoltage detection start time after startup. this start time can be calculated as follows: t4=2.2v (typ.) c ss / 10 a (typ.) (s) 2.2v (typ.): soft start output range c ss : ss pin external capacitor 10 a (typ.): soft start charge current u nder -voltage is detected after the soft start voltage reaches 2.2v (typ.). 0.92v uvlo vcc vreg fb oc sd out ss uvlo ovp t2 t1 0.80v 0.92v ovp t2 t1 t4 2.2v 2.2v t4 uvlo vcc vreg fb oc sd out ss uvlo uvp t2 0.80v 0.60v uvp t2 t1 t4 2.2v 2.2v 0.60v t1 t4 figure 17. overvoltage protection (ovp) timing chart figure 18. undervoltage protection (uvp) timing chart downloaded from: http:///
12 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 reference data non-isolated type application vreg en bg tsd osc vref protect logic tsd uvlo pwm comp slope drv set reset sw logic err amp vcc oc pgnd fb ss comp ovp enable gnd clamp vreg ocp ocp ovp osc rt out sd dc/dc shutdown uvp uvp vref figure 19. non-isolated type application circuit example dc/dc output downloaded from: http:///
13 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 flyback type application vreg en bg tsd osc vref protect logic tsd uvlo pwm comp slope drv set reset sw logic err amp vcc oc pgnd fb ss comp ovp enable gnd clamp vreg ocp ocp ovp osc rt out sd dc/dc shutdown uvp uvp vref figure 20 . flyback type application circuit example dc/dc output downloaded from: http:///
14 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 non-isolated application using sd there are many factors (e.g.pcb layout, external parts, etc.) that can affect the characteristics. therefore, please validate and confirm performance and functiona lity using lactual applications. vreg en bg tsd osc vref protect logic tsd uvlo pwm comp slope drv set reset sw logic err amp vcc oc pgnd fb ss comp ovp enable gnd clamp vreg ocp ocp ovp osc rt out sd dc/dc shutdown uvp uvp vref figure 21 . non-isolated application using sd circuit example dc/dc output downloaded from: http:///
15 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 selection of external components (1) setting the output l value (step- up dc/dc) though a coil is used for the following explanation, a tra nsformer can also be used for the same explanation. the rated current (ilr) of the output coil (l) is determined by the ma ximum input current iinmax figure 22 . coil current waveform (step-up dc/dc) figure 23 . output application circuit example (step-up dc/dc) please ensure that iinmax + il / 2 does not reach the rated current ilr. in this c ase il can be calculated using the formula below. il= 1 vcc x vo -vcc x 1 l vo f also, coil l has a variation of about 30% so please allow for a sufficient margin. if the coil current exceeds the coil rated current ilr, this might lead to damages to the ic internal components . (2) setting the output capacitor select the output capacitor considering the acceptable ripple voltage (vpp). the following equation is used to determine the output ripple voltage. (3) setting the input capacitor the input capacitor serves to lower the output impedance of the power source connected to the input pin. increased power supply output impedance can cause input voltage instabi lity and may negatively impact oscillation and ripple rejection characteristics. therefore, it is necessary to place an inpu t capacitor in close proximity to the vcc and gnd pins. a low - esr capacitor with a value between 10f and 100m? is recommended. selecting a capacitor with a value outside of the recommended range will lead to an excessive ripple voltage being superimposed on the input voltage and may cause the ic to malfunction. also, be certain to ascertain the operating temperature, load range and mosfet conditions for the application in which the capacitor will be used, since capacitor performance is heavi ly dependent on the applications input power characteristics, substrate wiring and mosfet gate drain capacity (4) setting the output voltage the output voltage is determined by the equation below. select a combination of r1 and r2 to obtain the required voltage. note that a small resistance value leads to a drop in power effi ciency and that a large resistance value leads, due to the error amp output drain current of 0.13a (typ .), to an increase of the offset voltage vpp = i lmax x r esr + 1 x vcc x (i lmax i l ) fco vo 2 il t i inmax + i l i inmax ? 2 vcc l i l vo co (a) f: switching frequency (v) (step-up dc/dc) vo ut = 0.8 r1 + r2 r2 i inmax average current vo r1 r2 internal reference 0.8v fb figure 22. output voltage setting circuit diagram downloaded from: http:///
16 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 (5) setting the oscillation frequency the internal oscillation frequency is determined by the resista nce value connected to rt. the setting range is 20khz to 600khz. the correlation between t he resistance value and the oscillation frequency is as shown in figure 23. a setting outside of the range shown below may cause the switching to stop after which opera tion is nolonger guaranteed. figure 23. rt resistance vs. oscillation frequency (6) soft start delay time in order to limit the current during startup the soft start pin nee ds to be connected to a capacitor. by connecting the capacitor output voltage overshoots and inrush currents can be p revented. the delay time is dependent on the capacit or value connected to the soft start pin and can be calcula ted using the formula below. (we recommend a capacitor with a value in the range o f 0.01 to 0.47f.) t ss (typ.) = (c ss x 0.8v (typ.) ) / 10a (typ. ) (s) (c ss : soft start pin external capacitor) note 0.8v : initial soft start voltage that vo outputs 10a : soft start charge current (7) overcurrent protection the overcurrent protection value is determined by the resistance (r oc ) connected between oc and gnd and the oc pin vcc ss vo 0.8v (typ.) t ss uvlo 10 100 0 500 1000 1500 2000 ? (khz) rt ? (k) figure 24 . soft start operating timing chart rt resistance (k ) oscillation frequency(khz) y = 22835 ? x^(-0.94) downloaded from: http:///
17 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 voltage and can be calculated by using the formula below. (3) setting the phase compensation circuit negative feedback stability conditions are as follows: ? at time of unity gain (0db) the phase delay should be 135 or less. (i .e. the phase margin is 45 or higher) ? as the dc/dc converter application is sampled according to the switch ing frequency, gbw (frequency at 0-db gain) of the overall system should be set to 1/10 or less of the switch ing frequency. thus, as the response is determined by the limitation of fc (gbw), i t is necessary to increase the switching frequency in order to raise the response. the phase compensation is set by the capacitors and resistors s erially connected to the comp pin. achieving stability by using the phase compensation is done by cancelling the 2 pol es (error amp pole and power stage pole) of the regulation loop by use of fz1. in the formula above, gea is the error amp transconductance (400a/v) and ave is the error amp vol tage gain (200v/v) this setting is obtained by using a simplified calcul ation, therefore, adjustment on the actual application may be required. also as these characteristics are influenced by the substrate layout, load conditions, etc. verification and confirmation with the actual application at time of mass production design is re commended. fp1 = g ea 2 c 1 a ve fp2 = 1 2 cor load fz = 1 2 c 1 r 1 r road r2r3 co comp r1 c1 vo outfb figure 25. phase compensation application circuit example roc io vocth vocth = voltage between oc and gnd e.g.) setting the overcurrent protection at 2a roc 2a = vocth roc = vocth 2a based on that the overcurrent detection threshold =0.2v (typ.) roc = 0.2 2a = 0.1 ? downloaded from: http:///
18 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 heat dissipation figure 26. shows the power dissipation and heat attenuation characteri stics of the ssop-b 16 package. even if the ambient temperature ta is at room temperature (25c), it can be that the chip (jun cture) temperature becomes very high. therefore, please be sure to operate the ic within the power dissipation range . ic mounted on a rohm standard board (70mm 70mm 1.6mm glass epoxy board) figure 26. ssop-b16 power dissipation heat attenuation characteris tics 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature:ta[ ] ja=143.7 /w -7.0mw/ 0.87w downloaded from: http:///
19 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits vreg out en 10k vcc 10k 172k 136k fb 5k 10k ?? 10k ?? comp 10k 100 ss 50 2k 10k rt ?? 100 oc vreg 100 sd 280 vcc vreg 175k 75k internal power supply internal power supply internal power supply downloaded from: http:///
20 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings exceeding the absolute maximum rating for supply voltage , operating temperature or other parameters, can result in destruction of the chip. in this event it also becomes im possible to determine the cause of the damage (e.g. short circuit, open circuit, etc). therefore, if any special mode i s being considered with values expected to exceed the absolute maximum ratings, implementing physical safety mea sures, such as adding fuses, should be considered. 2) electrical characteristics the electrical characteristics given in this specificatio n may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 3) gnd electric potential keep the gnd terminal potential at the lowest (minimum) potentia l under any operating condition. furthermore, excluding the gnd pin, the voltages of all pins should never drop below that of gnd. 4) gnd wiring pattern when both a small-signal gnd and a high current gnd are pre sent, single-point grounding (at the set standard point) is recommended. this must be done in order to separate th e small-signal and high current pat hs and to ensure that voltage changes stemming from the wiring resistance a nd high current do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoid an y changes in the ground paths of externally connected components. 5) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betwee n the output, input and gnd pin may result in damaging the ic. note: the overcurrent protection is not activated when the drain-s ource pin of the external fet is shorted. 6) operation in strong electromagnetic fields use caution when operating in the presence of strong electromagneti c fields, as this may cause the ic to malfunction. 7) testing on application boards the ic needs to be discharged after each test process. becau se when using an application board for testing, connecting a capacitor to a low-impedance pin may caus e stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take suffi cient caution with transportation and storage. also, make sure to turn off the power supply when connecting and disconn ecting the inspection equipment. 8) power dissipation should, by any chance, the power dissipation rating be exc eeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the power dissipati on value noted in this specification under absolute maximum ratings is the value in case of a 70mm70mm1.6mm glass epoxy board. in case this value is e xceeded please take appropriate measures such as increasing the board s ize. 9) thermal design the power dissipation under actual operating conditions s hould be taken into consideration and a sufficient marg in should be allowed for in the thermal design. 10) vcc pin please be sure to insert a capacitor between vcc and gnd. select the value of the capacitor based on the line of the power smoothing circuit and input pin (vcc). the capacitanc e setting may vary according to the application. therefore its value should be verified in actual application with a sufficient margin in place. it is recommend ed to us e a capacitor with good voltage and temperature characteristics. 11) capacitor connected to the vreg pin in order to prevent oscillation, a capacitor needs to b e placed between the output pin and gnd pin. it is recomm ended to us e a capacitor with a capacitance of 4.7f or higher. electro lytic, tantalum and ceramic capacitors can be used. when selecting the capac itor ensure that the capacitance of 4.7f or higher is maint ained at the intended applied voltage and temperature range. due to changes in temperature th e capacitors capacitance can fluctuate possibly resulting in oscillation. when selecting a ceramic type capacitor, we recommend us ing x5r, x7r or better with excellent temperature and dc -biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and lo ad current, select the capacitance in accordance with ve rifying that the actual application meets with the required specification. 12) en pin in case of connecting a resistor to the en pin, as shown in figures 19 to 21 , please ensure a setting in which the en pin voltage is higher than the on voltage (2.7v). downloaded from: http:///
21 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 13) sd pin in case of using a sd pin, as shown in figure 21., plea se sufficiently consider the operating voltage of the e xternal pchmos when setting the resistance value. 14) thermal shutdown (tsd) this ic incorporates an integrated thermal shutdown circuit to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (tj) will rise and the tsd circuit will be activate d and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operati on. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or fo r any purpose other than protecting the ic from heat damage. 15) based on the application the vcc and other pin voltages might be reversed, possibly resulting in circuit interna l damage or damage to components. for example, while the ex ternal capacitor is charged, vcc shorts to gnd. using reverse polarity diodes in series or a bypass diode between all pi ns and the vcc pin is therefore recommended. 16) applying a positive surge to the vcc pin in case surges exceeding 35v will be applied to the vc c pin, please place a power zener diode between vcc and gnd as shown in the figure below. 17) applying a negative surge to the vcc pin if the possibility exists that the vcc voltage will be low er than that of the gnd pin, please place a shottky diod e between vcc and gnd as shown in the figure below. 18) placing a protection diode if the possibility exists that a large inductive load is c onnected to the output pin resulting in back-emf at time of startu p and shutdown, a protection diode should be place as shown in th e figure below. vcc gnd vcc gnd downloaded from: http:///
22 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 19) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pin a for the resistor, or gn d > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasitic dio de described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. t heir influence can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. therefore, the input pin voltage should not be lower than the (p substrate) gnd in order to prevent the parasitic diodes to conduct. note concerning this document the japanese version of this document is the official spec ification. this translation should be seen as a reference to aid reading the official specification. in case of any discrapencies between the two versions, the offical version always takes precedence . gnd n p n n p+ p+ parasitic element or transistor p sub (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ resistor parasitic element p parasitic element (pin a) parasitic element or transistor (pin b) gnd c b e n gnd downloaded from: http:///
23 / 23 BD9031FV-C tsz02201-0t3t0an00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 17.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 9 0 3 1 f v - c e 2 part number package fv: ssop-b16 taping e2: reel-wound embossed tamping physical dimension tape and reel information marking diagram revision history date revision changes 27/mar/2012 001 initial draft 0 5/ nov/2012 002 p.10 change timing chart and the explanation o f detection time and release time p.11 add the overvoltage protection (ovp) timing chart and the und er voltage protection (uvp) timing chart 17 /jul/2014 003 p.16 size expansion of the expression to set frequency ssop-b16 (top view) d 9 0 3 1 part number marking lot number 1pin mark downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD9031FV-C

	To Download BD9031FV-C Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .